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Topic 1: Plasma etching processes for semiconductors (Si, III-V and III –N,…)
CMOS
power,
LED,
solar cells,..
Topic 2: Plasma etching processes for advanced memory technologies
OXRAM
PCRAM,
FeRAM
MRAM, ..
Topic 3: Plasma processes for more than Moore applications
MEMS
NEMS
Imagers
Photonics, ..
Topic 4: Emerging plasma etching concept and technology
Alternative lithography
ALE (atomic layer etching)
TSD (topographic selective deposition)
Topic 5: Plasma diagnostic and simulation
New Plasma Sources
Diagnostics
Modeling
Registration & Accommodation
INSIGHT OUTSIDE
26 Avenue Jean Kuntzmann
38330 Montbonnot
Tel: +33 825 595 525 (0,15€/min*)
Fax: +33 4 38 38 18 19
Information desk
Monday to Friday from 2pm to 5pm
pesm2023@insight-outside.fr
http://www.insight-outside.fr
Organization :
CEA-Leti
17 Avenue des Martyrs
38054 Grenoble Cedex
Thierry Chevolleau
thierry.chevolleau2@cea.fr
(*) Prices starting from fixed line incumbent, a surcharge may be applied by operators, counting the second after the first 45 seconds.
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