• PROGRAM

  • JUNE 19TH
  • Timing Speaker Affiliation Title
    09:15 Welcome
    Plasma processes for more than Moore applications
    09:30 Laourine Feriel CNRS-C2N Stainless steel patterning with ICP chlorinated plasma: Process optimization and understanding of etching mechanisms
    09:50 Selmouni Assia CEA-Leti Roughness and shape transfer during dry etching of grayscale three-dimensional patterns into a polymer layer
    10:10 Sarrazin Aurélien CEA-Leti Oxygen plasma study for direct bonding applications
    10:30 Coffee break
    10:50 Terzic Tamara Silicon Austria Labs GmbH Partial etching of Aluminum Scandium Nitride by Ion Beam Etching for next generation of RF MEMS Filter Applications
    11:10 Le Brun Nicolas STMicroelectronics PbS quantum dot thin film dry etching
    11:30 Wyndaele Pieter-Jan IMEC Adhesive Residue Cleaning of Transition Metal Dichalcogenides by Diluted Downstream Plasma Source Systems
    11:50 Raley Angelique TEL Advanced Etch Technologies for Photonics Waveguide Patterning
    12:10 Lunch break
    Plasma etching processes for advanced memory technologies
    13:30 Grenouillet Laurent (Invited) CEA-Leti Current status and scaling perspectives of ferroelectric non-volatile memories
    14:00 Franchina Vergel Nathali A. IMEC Challenges in SOT-MRAM patterning
    14:20 Fontaine Benjamin STMicroelectronics Ge-GST surface modification after hydrogen and nitrogen plasma etching
    14:40 Blanc Romuald IMEC Hard mask optimization for the IBE patterning of high density STT-MRAM at pitch 50nm and MTJ CD 20nm
    15:00 Hasegawa Tomo Airliquide laboratories New etchants designed for the etching of High Aspect Ratio (HAR) structures - Application to memory devices
    15:20 Jenny Cecile STMicroelectronics Dense capacitance pattern variability characterization and reduction by etch chemistry optimization
    15:40 Coffee break
    Plasma diagnostic and simulation
    16:00 Gilmore Thomas (Invited) Impedans Ltd Applications of RF Voltage-Current (VI) probes for understanding and controlling semiconductor plasmas
    16:30 Vanraes Patrick University of Antwerp Inverse aspect ratio dependent etching due to the diffuse reflection of neutrals
    16:50 Crespi Angela CNRS-GREMI Ion energy optimization for GaN High Electron Mobility Transistor etching
    17:10 Rudolph Matthias Fraunhofer Institute for Photonic Microsystems IPMS CNT Plasma diagnostics of pulsed RF excitations on industrial dual frequency CCP etching tool
    17:30 Poster session
      Andrianov Nikolai Silicon Austaria Labs Impact of CH4/H2 gas admixture on Pb(Zr1-xTix)O3 ICP-RIE etching performance
      Cascales David UGA-LTM / CEA-Leti Impact of the GaN plasma etching chemistry on the gate’s morphology, etch rate and electrical performance for MOSc-HEMT devices
      Chan Cinzia IMEC Development of a residue collection methodology for sidewall characterization after Ion Beam Etching of Magnetic Tunnel Junction
      Cunge Gilles CNRS-LTM Diagnostics of industrial plasma reactors to assist process development
      Daviot Jérôme Technic Wafer surface residues removal, when legacy processes are challenged
      Despiau-Pujo Emilie UGA-LTM Helium and hydrogen plasmas interaction with Si3N4 and SiO2 materials for advanced etch applications : A molecular dynamics study
      Dittmar Nils Fraunhofer Institute for Electronic Nano Systems Transferring reflowed photo resist structures into Si3N4 on Si by reactive ion etching
      Ettouri Rim University of Orleans-GREMI Understanding the Plasma-Surface Interactions during Bulk Titanium Etching Processes in Fluorine-Based Plasmas
      Haase Micha Fraunhofer Institute for Electronic Nano Systems ENAS On the feature extraction of time-resolved optical emission spectra
      Ji You Jin Sungkyunkwan university Selective etching characteristics of silicon nitride over silicon oxide by ClF3/H2 remote plasma
      Kannan Jenefa Fraunhofer IPMS-CNT Development of quasi atomic layer etching of low-k dielectrics with C4F8 and O2 gas pulsing
      Kastania Athina S. Institute of Nanoscience and Nanotechnology (INN), NCSR Demokritos SERS of plasma micro-nanotextured and sputtered with Ag PMMA surfaces
      Kastania Athina S. Institute of Nanoscience and Nanotechnology (INN), NCSR Demokritos Plasma-induced nanotexturing on horizontal and inclined polymeric surfaces
      Kim Doo San Sungkyunkwan University Improvement of etch characteristics of magnetic tunnel junction (MTJ) layer using RF-biased reactive ion beam
      Labchir Nabil CNRS-LTM Plasma etching of nanopatterned GaN-based pillars for integrated μLEDs fabrication: application in μDisplays
      Rochdi Nouhaila UGA-LTM Study of the impact of the aspect ratio of etched silicon wafers on the ion angular distribution and ion energy distribution in pulsed plasma etching
      Sales de Mello Saron Rosy UGA-LTM Cathodoluminescence characterization of the plasma induced damage during the patterning of high aspect ratio GaN nanowires
      Zhang Tinghui CNRS-GREMI Discharge physics and GaN atomic layer etching in SF6/Ar inductively coupled plasmas
    19:00  
  • JUNE 20TH
  • Timing Speaker Affiliation Title
    Plasma diagnostic and simulation
    09:00 Ducluzaux Pierre STMicroelectronics Carbon Resist Microlens Etching in DF-CCP CF4 plasmas: Numerical investigation versus experiments
    09:20 Melzer Marcel TU Chemnitz Measurement of the ion angle distribution function in low-pressure plasmas using a microelectromechanical system
    09:40 Zhang Shu Ecole Polytechnique-LPP Experimental study of an RF CCP in oxygen at intermediate pressure
    Plasma etching processes for semiconductors (Si, III-V and III –N,…)
    10:00 Stefan Decoster (Invited) Imec Direct metal etch for nano-interconnect applications at 20 nm pitch and below
    10:30 Coffee Break
    10:50 Ferlazzo Laurence CNRS-C2N Orientation dependent profiles on HBr-O2 ICP-RIE etched InAs(Sb) patterns
    11:10 Dupuy Emmanuel IMEC Gate etch challenges in a monolithic CFET integration
    11:30 Vinicius Antunes CNRS-LTM Bias pulsed plasma processes for smoothing sidewalls of SiN WG
    11:50 Jaloustre Lucas CNRS-LTM Plasma etching of high aspect ratio GaN and AlN nanopillar arrays for next generation of ultraviolet lightemitting diodes fabrication
    12:10 Fassion Andréa CEA-Leti Selective ICP etching of Si3N4 over SiO2 in oxygen rich hydrofluorocarbon based plasma: Investigation of mechanisms
    12:30 Nos Jack Université d'Orléans-GREMI Evaluation of Bosch processing at cryogenic temperatures
    12:50 Lunch break
    Emerging plasma etching concept and technology
    14:00 Metzler Dominik (Invited) IBM Control of Plasma Etch Conditions through Pulsed, Cyclic, and QALE Processes for Advanced Node Applications
    14:30 Bezard philippe IMEC Fast Quasi-Atomic Layer Etching and surface treatments for defectivity reduction of ultra-thin Extreme UV photoresists
    14:50 Ronco Antoine CEA-Leti Transferring a SiO2/SiN quasi-ALE process from blanket to pattern etching
    15:10 de Marneffe Jean-Francois IMEC Anisotropic patterning of Ni3Al by the hybrid RIE-ALE technique
    15:30 Coffee Break
    15:50 Putranto Achmad Fajar UGA-LTM Plasma etching processes of a sub-10 nm resolution high-χ block copolymer self-assembled into spin-on-carbon trenches
    16:10 Fathzadeh Atefeh IMEC High-speed Hybrid- Atomic Layer Etching of amorphous Carbon using a purge-less approach
    16:30 Gassilloud Rémy CEA-Leti Area selective deposition using alternate deposition and etching strategies
    16:50 Closing remarks
  • Registration & Accommodation
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