Let’s start with completing my Bachelor degree in Physics from the LMU Munich in 2010, before attending the University of Maryland, College Park, at the Institute for Research in Electronics and Applied Physics from 2010 to 2016. My main focus during that time in Prof Oehrlein’s lab was the development of fluorocarbon based atomic layer etching of SiO2, SiN, and Si. I received my PhD in the spring of 2016. In June of 2016 I started working at IBM Research in Albany, NY. In the over six years working as a process engineer at IBM Research, I mainly focused on BEOL RIE for various application, e.g. in logic scaling and MRAM. In the recent years I have expanded my role from an etch process engineer outside of the RIE sector directly into design, lithography, integration, and project planning.