ABSTRACT SUBMISSION IS OPEN!
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General rules for abstract submission
- Each participant may submit up to 2 abstracts:
- 1 invited talk + 1 poster
- 1 oral + 1 poster
- 2 posters
- The presenting author should attend the conference on site.
- Only abstracts from registered delegates who paid the registration fees in full will be considered for program planning and published.
Submission guidelines
- Language: All submitted material shall be written in English.
- Preference: Choose oral presentation or poster session.
- Topics: Please choose one of the 5 topics
- Plasma etching processes for III-V and III-N semiconductor materials
- Plasma etching processes for advanced memory technologies
- Plasma processes for more than Moore applications
- Emerging plasma etching concept and technology fundamentals
- Plasma diagnostics and simulation
- Title of presentation: Please provide a title (maximum of 50 words) that clearly indicates the content of the contribution. Avoid abbreviations in the title. Abbreviations may be used in the abstract if they are defined when first used.
- Main author: Name, email, affiliation (institution/company), city and country.
- Co-authors: Name, email, affiliation, city and country.
- Abstract: Please ensure that you follow the provided template.
IMPORTANT:
- There are no fees for submitting abstracts.
- Abstracts will be made available to the participants in electronic form. The author is solely responsible for the ethical and scientific content of the submission.
- The presenting author is expected to present the work in-person during the congress (oral or poster session). In the event that this is not possible, the main author may delegate the presentation to one of the co-authors.
Key dates
Opening for submission : January, 9th 2023
Abstracts are due : February, 24th 2023
Notification of authors : March, 24th 2023